| Company: | HP |
|---|---|
| Job Role: | R&D Intern – 3D Printing Thermal HW Development. |
| Experience: | Freshers (New Graduates). |
| Vacancy: | 80+ |
| Qualification: | BE/B.Tech, MSc/BSc or related degree. |
| Stipend: | EUR 12,000/month. |
| Location: | Sant Cugat del Valle - Barcelona - Spain. |
| Join us on Telegram | Click Here |
| Apply Mode: | (Online) |
| Deadline: | Not Mentioned |
- In support of senior engineers on research and development of thermal processes, mechanical systems, and other hardware solutions for energy management and thermal control of 3D printers, along with algorithms and workflows required to operate them
- Execute and document tests for thermal management and/or other HW areas in printer development: test plans, test setups, test execution and data verification
- Setup, handling, calibration, and operation of high-end instruments like thermo-cameras, thermistors, data loggers, etc.
- Data collection, analysis, interpretation, and reporting of test results
- Developing, validating, and retrofitting analytical models for energy/thermal analysis. Computerized tools (e.g. Matlab, Maxima, Python, Excel, etc.), desirable CAE fundamentals (FEA, CFD, etc.)
- Tools and setups for testing, and support for printer components development.
- BSC (Grade) or Master student in Mechanical, Aeronautical/Aerospace or similar engineering grade. Minimum finished 3 years of the grade required. Academic expediency will be valued in the selection.
- Thermal, energy management and mechanical/hardware design profile
- Strong analytical capacities. Proficiency in mathematics, statistics and data analysis.
- Programming skills
- Academic expedient will be valued during the selection
- Fast-learning and growth mindset
- High technical competence and engineering orientation
- Self-organization and responsibility
- Flexibility, adaptability and capacity to operate in a very dynamic environment
- Teamwork skills
- Fluent in English
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